JPS6232555U - - Google Patents

Info

Publication number
JPS6232555U
JPS6232555U JP12366885U JP12366885U JPS6232555U JP S6232555 U JPS6232555 U JP S6232555U JP 12366885 U JP12366885 U JP 12366885U JP 12366885 U JP12366885 U JP 12366885U JP S6232555 U JPS6232555 U JP S6232555U
Authority
JP
Japan
Prior art keywords
case
semiconductor element
gate
overvoltage protection
copper post
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12366885U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0526773Y2 (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985123668U priority Critical patent/JPH0526773Y2/ja
Publication of JPS6232555U publication Critical patent/JPS6232555U/ja
Application granted granted Critical
Publication of JPH0526773Y2 publication Critical patent/JPH0526773Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thyristors (AREA)
JP1985123668U 1985-08-12 1985-08-12 Expired - Lifetime JPH0526773Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985123668U JPH0526773Y2 (en]) 1985-08-12 1985-08-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985123668U JPH0526773Y2 (en]) 1985-08-12 1985-08-12

Publications (2)

Publication Number Publication Date
JPS6232555U true JPS6232555U (en]) 1987-02-26
JPH0526773Y2 JPH0526773Y2 (en]) 1993-07-07

Family

ID=31014975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985123668U Expired - Lifetime JPH0526773Y2 (en]) 1985-08-12 1985-08-12

Country Status (1)

Country Link
JP (1) JPH0526773Y2 (en])

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05129538A (ja) * 1991-10-30 1993-05-25 Toyo Electric Mfg Co Ltd 複合形半導体素子の構造
WO2000042664A1 (fr) * 1999-01-18 2000-07-20 Mitsubishi Denki Kabushiki Kaisha Dispositif a semiconducteur colle par compression

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5791258U (en]) * 1980-11-26 1982-06-04

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5791258U (en]) * 1980-11-26 1982-06-04

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05129538A (ja) * 1991-10-30 1993-05-25 Toyo Electric Mfg Co Ltd 複合形半導体素子の構造
WO2000042664A1 (fr) * 1999-01-18 2000-07-20 Mitsubishi Denki Kabushiki Kaisha Dispositif a semiconducteur colle par compression

Also Published As

Publication number Publication date
JPH0526773Y2 (en]) 1993-07-07

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